H.-S. Lee, S.-H. Son, C.-S. Lee
The LED has already been a key issue for substitution of conventional lights such as a fluorescent lamp and a glow lamp in electronic applications. However, the heat dissipation of LED module has been a critical problem with increasing their power, from which the abrupt fracture often occurred because of no enough heat dissipation. We investigated the heat dissipation of LED module with sizes and pitches of thermal via.
The size of thermal via ranged 0.2~1.2mm and the pitch of thermal via ranged 0.5~3mm were built up and mounted with 1W and 3W LED. It was analyzed by the thermal transient tester that the thermal response curve was changed with the design of samples such as via sizes and pitches, which was also analyzed by contacting a thermo-couple into the top and bottom side of LED module. As the results, we convincingly proved the relationships between the design of thermal via and the heat dissipation of LED module, which were directly applicable to LED industry.
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ExtreMat is funded within the Sixth Framework Programme of the European Community. |
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