Further development in many technical fields is strongly hampered by the raising problem of thermal management of high-tech components. At present overheating causes more than 50 % failures of electronic devices and the high temperature becomes a limiting factor also in construction of heat exchangers, fusion reactors, thrusters chambers, brake systems, aircraft engine parts etc.
The introduction of new high performance electronic components or high temperature plasma reactors constantly generating more heat than their current predecessors will in short term require novel thermal management approaches able to dissipate almost 20 MW per square meter. This will be possible only with heat spreaders or heat sinks made of materials possessing extremely high thermal conductivity, ability to withstand large temperature changes without disintegration and deterioration of properties and capability to reduce complex thermo-mechanical stresses after bonding to supporting or protecting structures by tailoring of CTE. Novel heat sinks materials are inevitable for further minimisation of components, better functional integration, easier manufacturing and
consequently also for the reduction of component costs. This symposium will be devoted to presentation of state of the art in the development of such functional materials. Papers are invited addressing novel composites with high thermal conductivity and controlled CTE, processing
technology for their manufacturing, design of interface with minimum thermal resistance, component design criteria, testing approaches, simulation and modelling of heat sink architecture and performance, etc. Alternative approaches including active cooling, heat pipes and industrial requirements on materials needed for their applications will be presented as well.

F. Simancik, Slovak Academy of Sciences, Bratislava
R. Martin, Materials Engineering Research Laboratory Ltd., Hitchin

Conference Abstracts

B41 Heat Sink and High Temperature Composites

	Thermal Management for Microelectronics Using Composite Materials read more
	The Influence of Active Element Additions in Cu-Diamond Composites read more
	Thermal Expansion of Metal Matrix Composites Highly Loaded with read more
	The Effect of Particle Contiguity on the Thermal Expansion of Al/Al2O3 read more
	SiC Multilayer by Tape Casting and Sintering for Thermal Protection read more
	High Conductivity Copper-Carbon Composites read more
	Thermophysical Properties of Copper-Diamond Composites Made from read more
	SiC Long Fibre Reinforced Copper for the Divertor Heat Sink read more
	The Design of the Interface in SiC-Fibre and W-Filament Reinforced read more
	Cu/W Heat Sink with Extremely High Thermal Stability read more
	Heat Sinks Based in Carbon Technology read more
	Finely Dispersed SiC-B4C/C Composites for Aerospace Applications read more
	Characteristic of Structure and Composition of Metal/Ceramics read more
	Modeling of Heat Transfer and Mechanical Properties in Diamond read more
	Interfacial Characterisation of Tungsten Fibre Reinforced Copper for read more
	Thermal Conductivity and Interfacial Conductance of Aluminum Nitride read more
	Mechanical Properties of SiC-Fibre and W-Wire Reinforced Cu- and read more
	Aluminum Based Composites Reinforced by Mixtures of Diamond and read more