Thermal Management for Microelectronics Using Composite Materials

A. Kelly (Sp), University of Cambridge (UK); P.W. May, University of Bristol (UK); L.N. McCartney,
National Physical Laboratory, Teddington (UK); L. Weber, Swiss Federal Institute of Technology,
Lausanne (Switzerland)

A prize goal for an electronic substrate is a material with (a) a thermal expansion coefficient equal to that of
silicon (2.6ppm/K) at room temperature and (b) possessing a high thermal conductivity of 400W/mK or greater.
As a result of an informal collaboration between the three of us it will be demonstrated that three composite
arrangements are capable of achieving the first of these goals, using (1) particulates, (2) using cross-plied
laminates and (3) employing aligned fibres. The second of these methods is the easiest to use but the least likely
to meet the second requirement.
Using diamond and graphite fibres and diamond particulates
it will be demonstrated experimentally that the second goal together with the first may also be achieved using
aligned fibres and particulates together.