06. 09. 2007
L. Weber* and R. Tavangar
The evolution of the thermal conductivity and the coefficient of thermal expansion as a function of the alloying content of boron and chromium in the copper matrix in Cu–X/diamond composites is presented. In both systems a transition from weak matrix/diamond bonding to strong bonding is observed, the latter leading concomitantly to high thermal conductivity (>600 W m1 K1) and a low coefficient of thermal expansion (<10 ppm K1).