07. 11. 2007
T. Schubert, Ł. Ciupin, W. Zielin, A. Michalski, T. Weißgärbera and B. Kiebacka
Copper/diamond composites were produced by the powder metallurgical method. It is known from former experiments, that there is a very weak bonding between as-received diamonds and pure copper matrix in the consolidated composite. Improvements in bonding strength and thermo-physical properties of the composites were achieved using atomized copper alloy with minor additions of chromium to increase the interfacial bonding in Cu/diamond composites by a thin nano-sized Cr3C2 layer.
